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Tech of the Week
Promising technologies available for sale/license.
Flexible circuit boards with enhanced heat removal
-- This technology provides a novel treatment for hexagonal boron nitride (hBN) that enhances compatibility with thermoset polymers and provides increased thermal conductivity.
New custom-engineered material for O-rings, gaskets, and seals for extremely high-pressure, high-temperature environments exposed to harsh chemicals and solvents
-- The physical properties of ExPhite composite open up a variety of new markets and applications with advantages that go well beyond existing materials and practices.
Can you solve these technology needs?
Seeking: Software/algorithms for identification and gesture recognition
-- This need seeks overhead person-recognition and interpretation of gestures (not simply recognition that gestures have taken place) for a known dataset of people.
Seeking: On-demand, multiple material manufacturing with integrated processing
-- Many available technologies print in a single material (plastic or metal) and require significant human input. Advances in printing multiple materials or incorporating pre- and post-processing on a single system will soon be available.
Seeking: Foods and functional ingredients that help prevent sleepiness after lunch
-- Your proposed solution will have been tested on food and be safe for consumption. Ideally it will be ready to be added and tested within a wide range of recipes.
Seeking: Innovative torque-transfer device
-- Using lubrication means exposing this system to additional oil transportation losses or additional weight and complexity. We want your innovative solution to run without lubrication.
Technology Marketplace Report
Uniform pre-heating, Custom-engineered material, You know your market (Jul 21 2016)
The Technology Marketplace Report is a list of selected technologies from our database targeted to users with customized interest areas.
See other Technology Marketplace Reports.
Sharp has established a technology ventures organization to exploit its intellectual property.
´s new TechPak listing format provides a common platform for describing and listing licensable technologies.
Browse through the archive of previous Tech of the Week articles, TechNeed Challenges, Technology Marketplace Reports, Industry Features and Feature Stories.
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